Purpose-built dielectric fluids designed to enable higher compute density in AI and HPC data centers
Infinium Immersion Fluids
Infinium Immersion Fluids are proprietary low-carbon dielectric liquids developed to deliver exceptional thermal performance, stability, and safety for the world’s most demanding AI and data center environments. Formulated through advanced synthetic chemistry, these fluids transfer heat directly from compute components, enabling superior cooling efficiency, lower power consumption, and zero water usage.
Developed as a complementary product line to Infinium’s eFuel platform, the fluids extend Infinium’s mission to decarbonize critical infrastructure through carbon-negative chemistry.
Why Immersion Cooling
Modern GPUs and accelerators are pushing compute infrastructure toward a cooling tipping point. As power density increases and AI workloads run at sustained utilization, traditional cooling approaches struggle to maintain reliable thermal performance. Even with enhanced air management or rear-door exchangers, energy and water usage remain key barriers to scaling for conventional data center designs.
By surrounding IT equipment in a non-conductive dielectric fluid, immersion cooling removes heat uniformly and eliminates thermal bottlenecks as compute energy density continues to rise. This approach simplifies infrastructure, improves efficiency, and allows sustained performance in ultra-high-density environments.
Infinium Immersion Fluid Solution Addresses Key Market Challenges
Unlike conventional coolants or fluorinated fluids, Infinium Edge™ Immersion Fluids are chemically stable, non-conductive, and fully compatible with a wide range of electronic materials—ensuring long-term reliability and minimal maintenance.
| The Challenge | Infinium Immersion Solution |
|---|---|
| Thermal limitations – Conventional cooling cannot manage modern GPU heat loads. | High thermal performance enables stable operation in high-density racks. |
| High energy use – Cooling consumes a large share of total facility power. | Enables up to 95% lower cooling energy compared to legacy air systems. |
| Water dependence – Traditional cooling relies on chillers and evaporative systems. | Closed-loop immersion design eliminates chillers and minimizes water use. |
| Maintenance complexity – Fans, filters, and HVAC systems increase cost and downtime. | Supports simplified, sealed architecture with extended maintenance intervals. |
| Sustainability pressures – Facilities face rising carbon and ESG requirements. | Carbon-negative chemistry from Infinium’s Power-to-Liquids platform reduces lifecycle emissions. |
Key Features of Infinium Immersion Fluids
Performance and Efficiency
Enables high-density, low-energy cooling for AI, HPC, and cloud workloads.
Reduces overall cooling energy use by up to 95% versus air-based systems.
Supports consistent thermal performance in dense rack configurations.
Sustainability
Produced using Infinium’s proprietary eFuel (Power-to-Liquids) technology, combining CO₂, water, and renewable electricity.
Carbon-negative lifecycle supports sustainability and ESG objectives.
Reduces facility footprint by eliminating chillers, CRACs, and raised-floor infrastructure.
Reclaimable and recyclable, supporting closed-loop reuse models.
Applications
AI and machine learning clusters
High-performance computing (HPC) systems
Hyperscale and modular data centers
Edge and retrofit deployments replacing air cooling
Safety and Reliability
Fully non-conductive and non-corrosive, ensuring hardware protection and stable operation.
Designed for compatibility with common data-center materials and components.
Low-maintenance design reduces mechanical complexity and operating costs.
Built for the Future of Compute
By combining advanced thermal performance with carbon-negative chemistry, Infinium delivers a solution that reduces operational cost and environmental impact, enabling next-generation compute performance with measurable sustainability gains.
Learn how Infinium Immersion Fluids are designed to be used in next-generation compute and cooling architectures.